Part Number Hot Search : 
C1623 1029132 2SK1256 LA13WBD IL2010B 74408 DDZ9686 F9540
Product Description
Full Text Search
 

To Download L6387E Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 L6387E
High-voltage high and low side driver
Features

High voltage rail up to 600V dV/dt immunity 50V/nsec in full temperature range Driver current capability: - 400mA source, - 650mA sink Switching times 50/30 nsec rise/fall with 1nF load CMOS/TTL Schmitt trigger inputs with hysteresis and pull down Internal bootstrap diode Outputs in phase with inputs Interlocking function
DIP-8 SO-8
Description
The L6387E is an high-voltage device, manufactured with the BCD"OFF-LINE" technology. It has a Driver structure that enables to drive independent referenced N Channel Power MOS or IGBT. The high side (Floating) Section is enabled to work with voltage Rail up to 600V. The Logic Inputs are CMOS/TTL compatible for ease of interfacing with controlling devices.

Figure 1.
Block diagram
BOOTSTRAP DRIVER
8
Vboot H.V. Cboot
VCC
3
UV DETECTION R
HVG DRIVER S VCC 7
HVG
HIN
2
LOGIC
LEVEL SHIFTER
OUT 6 5 LVG DRIVER LVG TO LOAD
LIN
1
4
GND
D00IN1135
October 2007
Rev 1
1/15
www.st.com 15
Contents
L6387E
Contents
1 Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 1.2 1.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 3
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 3.2 AC operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DC operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 5
Input logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Bootstrap driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 CBOOT selection and charging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6 7 8 9
Typical characteristic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2/15
L6387E
Electrical data
1
1.1
Electrical data
Absolute maximum ratings
Table 1.
Symbol Vout Vcc Vboot Vhvg Vlvg Vi dVout/dt Ptot Tj Ts Output voltage Supply voltage Floating supply voltage High side gate output voltage Low side gate output voltage Logic input voltage Allowed output slew rate Total power dissipation (TJ = 85 C) Junction temperature Storage temperature
Absolute maximum ratings
Parameter Value -3 to Vboot -18 - 0.3 to +18 -1 to 618 -1 to Vboot -0.3 to Vcc +0.3 -0.3 to Vcc +0.3 50 750 150 -50 to 150 Unit V V V V V V V/ns mW C C
Note:
ESD immunity for pins 6, 7 and 8 is guaranteed up to 900 V (Human Body Model)
1.2
Thermal data
Table 2.
Symbol Rth(JA)
Thermal data
Parameter Thermal Resistance Junction to ambient SO-8 150 DIP-8 100 Unit C/W
1.3
Recommended operating conditions
Table 3.
Symbol Vout VBS
(2)
Recommended operating conditions
Pin 6 8 Parameter Output voltage Floating supply voltage Switching frequency 3 Supply voltage Junction temperature -45 HVG,LVG load CL = 1nF Test condition Min
(1) (1)
Typ
Max 580 17 400 17 125
Unit V V kHz V C
fsw Vcc
TJ
1. If the condition Vboot - Vout < 18V is guaranteed, Vout can range from -3 to 580V 2. VBS = Vboot - Vout
3/15
Pin connection
L6387E
2
Pin connection
Figure 2. Pin connection (Top view)
LIN HIN VCC GND 1 2 3 4
D97IN517A
8 7 6 5
Vboot HVG OUT LVG
Table 4.
N 1 2 3 4 5 6 7 8
Pin description
Pin LIN HIN Vcc GND LVG (1) VOUT HVG (1) Vboot O O O Type I I Low side driver logic input High side driver logic input Low voltage power supply Ground Low side driver output High side driver floating reference High side driver output Bootstrap supply voltage Function
1. The circuit guarantees 0.3V maximum on the pin (@ Isink = 10mA). This allows to omit the "bleeder" resistor connected between the gate and the source of the external MOSFET normally used to hold the pin low.
4/15
L6387E
Electrical characteristics
3
3.1
Electrical characteristics
AC operation
Table 5.
Symbol ton toff tr tf
AC operation electrical characteristcs (VCC = 15V; TJ = 25C)
Pin Parameter Test condition Vout = 0V Vout = 0V CL = 1000pF CL = 1000pF Min Typ 110 105 50 30 Max Unit ns ns ns ns
1 vs 5 High/low side driver turn-on 2 vs 7 propagation delay 1 vs 5 High/low side driver turn-off 2 vs 7 propagation delay 5, 7 5, 7 Rise time Fall time
3.2
DC operation
Table 6.
Symbol
DC operation electrical characteristcs (VCC = 15V; TJ = 25C)
Pin Parameter Test condition Min Typ Max Unit
Low supply voltage section Vcc Vccth1 Vccth2 Vcchys 3 Iqccu Iqcc Rdson Supply voltage Vcc UV turn on threshold Vcc UV turn off threshold Vcc UV hysteresis Undervoltage quiescent supply current Quiescent current Bootstrap driver on resistance(1) Vcc 9V Vcc = 15V Vcc 12.5V 5.5 5 6 5.5 0.5 150 250 125 220 320 17 6.5 6 V V V V A A
Bootstrapped supply voltage section VBS IQBS ILK 8 Bootstrap supply voltage VBS quiescent current High voltage leakage current HVG ON Vhvg = Vout = Vboot = 600V 17 100 10 V A A
High/low side driver Iso Isi Source short circuit current 5,7 Sink short circuit current VIN = Vih (tp < 10s) VIN = Vil (tp < 10s) 300 450 400 650 mA mA
5/15
Input logic Table 6.
Symbol
L6387E DC operation electrical characteristcs (continued)(VCC = 15V; TJ = 25C)
Pin Parameter Test condition Min Typ Max Unit
Logic inputs Vil Vih Iih Iil 1,2 Low level logic threshold voltage High level logic threshold voltage High level logic input current Low level logic input current VIN = 15V VIN = 0V 3.6 50 70 1 1.5 V V mA mA
1. RDS(on) is tested in the following way:
( V CC - V CBOOT1 ) - ( V CC - V CBOOT2 ) R DSON = -----------------------------------------------------------------------------------------------------I 1 ( V CC ,V CBOOT1 ) - I 2 ( V CC ,V CBOOT2 )
where I1 is pin 8 current when VCBOOT = VCBOOT1, I2 when VCBOOT = VCBOOT2
4
Input logic
L6387E Input Logic is VCC (17V) compatible. An interlocking features is offered (see truth table below) to avoid undesired simultaneous turn ON of both Power Switches driven. Table 7.
Input LIN HVG Output LVG 0 1 0 0 0 0 1 0 0 1 1 0
Input logic
HIN 0 0 1 1
6/15
L6387E
Bootstrap driver
5
Bootstrap driver
A bootstrap circuitry is needed to supply the high voltage section. This function is normally accomplished by a high voltage fast recovery diode (Figure 3 a). In the L6387E a patented integrated structure replaces the external diode. It is realized by a high voltage DMOS, driven synchronously with the low side driver (LVG), with in series a diode, as shown in Figure 3 b. An internal charge pump (Figure 3 b) provides the DMOS driving voltage. The diode connected in series to the DMOS has been added to avoid undesirable turn on of it.
5.1
CBOOT selection and charging
To choose the proper CBOOT value the external MOS can be seen as an equivalent capacitor. This capacitor CEXT is related to the MOS total gate charge:
Q gate C EXT = -------------V gate
The ratio between the capacitors CEXT and CBOOT is proportional to the cyclical voltage loss. It has to be:
CBOOT>>>CEXT
e.g.: if Qgate is 30nC and Vgate is 10V, CEXT is 3nF. With CBOOT = 100nF the drop would be 300mV. If HVG has to be supplied for a long time, the CBOOT selection has to take into account also the leakage losses. e.g.: HVG steady state consumption is lower than 200A, so if HVG TON is 5ms, CBOOT has to supply 1C to CEXT. This charge on a 1F capacitor means a voltage drop of 1V. The internal bootstrap driver gives great advantages: the external fast recovery diode can be avoided (it usually has great leakage current). This structure can work only if VOUT is close to GND (or lower) and in the meanwhile the LVG is on. The charging time (Tcharge ) of the CBOOT is the time in which both conditions are fulfilled and it has to be long enough to charge the capacitor. The bootstrap driver introduces a voltage drop due to the DMOS RDSON (typical value: 125 ). At low frequency this drop can be neglected. Anyway increasing the frequency it must be taken in to account. The following equation is useful to compute the drop on the bootstrap DMOS:
Q gate V drop = I ch arg e R dson V drop = ------------------ R dson T ch arg e
where Qgate is the gate charge of the external power MOS, Rdson is the on resistance of the bootstrap DMOS, and Tcharge is the charging time of the bootstrap capacitor.
7/15
Bootstrap driver
L6387E
For example: using a power MOS with a total gate charge of 30nC the drop on the bootstrap DMOS is about 1V, if the Tcharge is 5s. In fact:
30nC V drop = -------------- 125 0.8V 5s
Vdrop has to be taken into account when the voltage drop on CBOOT is calculated: if this drop is too high, or the circuit topology doesn't allow a sufficient charging time, an external diode can be used. Figure 3. Bootstrap driver
DBOOT
VS
VBOOT H.V. HVG
CBOOT VOUT TO LOAD
LVG
a
VBOOT H.V. HVG
VS
CBOOT VOUT TO LOAD
LVG
b
D99IN1056
8/15
L6387E
Typical characteristic
6
Typical characteristic
Figure 4.
time (nsec) 250 200 Tr 150 Tf 100 50 0
Typical rise and fall times vs load capacitance
D99IN1054
Figure 5.
Iq (A) 104
Quiescent current vs supply voltage
D99IN1055
103
102
10
0 1 2 3 4 5 C (nF) For both high and low side buffers @25C Tamb
0
2
4
6
8
10
12
14
16 VS(V)
Figure 6.
250
Turn on time vs temperature
@ Vcc = 15V
Figure 7.
250
Turn Off time vs temperature
@ Vcc = 15V
200
200 Toff (ns) 150 100 50 0 -45 -25 0 25 50 Tj (C) 75 100 125
Typ.
Ton (ns)
150 100 50 0 -45 -25 0 25 50 Tj (C) 75 100 125
Typ.
Figure 8.
1000
Output source current vs temperature
@ Vcc = 15V
Figure 9.
1000
Output sink current vs temperature
@ Vcc = 15V
800
800 current (mA) 600 400 200 0
Typ.
current (mA)
600
Typ.
400 200 0 -45 -25 0 25 50 Tj (C) 75 100 125
-45
-25
0
25 50 Tj (C)
75
100 125
9/15
Package mechanical data
L6387E
7
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
10/15
L6387E
Package mechanical data Figure 10. DIP-8 mechanical data and package dimensions
mm DIM. MIN. A a1 B b b1 D E e e3 e4 F I L Z 3.18 7.95 2.54 7.62 7.62 6.6 5.08 3.81 1.52 0.125 0.51 1.15 0.356 0.204 1.65 0.55 0.304 10.92 9.75 0.313 0.100 0.300 0.300 0.260 0.200 0.150 0.060 TYP. 3.32 0.020 0.045 0.014 0.008 0.065 0.022 0.012 0.430 0.384 MAX. MIN. TYP. 0.131 MAX. inch
OUTLINE AND MECHANICAL DATA
DIP-8
11/15
Package mechanical data Figure 11. SO-8 mechanical data and package dimensions
mm DIM. MIN. A A1 A2 b c D
(1)
L6387E
inch MAX. 1.750 MIN. TYP. MAX. 0.0689 0.0098
TYP.
OUTLINE AND MECHANICAL DATA
0.100 1.250 0.280 0.170 4.800 5.800 3.800 4.900 6.000 3.900 1.270 0.250 0.400 1.040 0
0.250 0.0039 0.0492 0.480 0.0110 0.230 0.0067
0.0189 0.0091
5.000 0.1890 0.1929 0.1969 6.200 0.2283 0.2362 0.2441 4.000 0.1496 0.1535 0.1575 0.0500 0.500 0.0098 1.270 0.0157 0.0409 8 0.100 0 8 0.0039 0.0197 0.0500
E E1
(2)
e h L L1 k ccc
Notes: 1. Dimensions D does not include mold flash, protrusions or gate burrs. Mold flash, potrusions or gate burrs shall not exceed 0.15mm in total (both side). 2. Dimension "E1" does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side.
SO-8
0016023 D
12/15
L6387E
Order codes
8
Order codes
Table 8. Order codes
Part number L6387E L6387ED L6387ED013TR Package DIP-8 SO-8 SO-8 Packaging Tube Tube Tape and reel
13/15
Revision history
L6387E
9
Revision history
Table 9.
Date 11-Oct-2007
Document revision history
Revision 1 First release Changes
14/15
L6387E
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
15/15


▲Up To Search▲   

 
Price & Availability of L6387E

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X